Conference Proceedings
The HWCVD10 conference proceedings will be published in Thin Solid Films as a Special Conference Issue. All papers presented at the HWCVD10 Conference can be submitted for consideration in the proceedings.
Conference papers should be submitted through Elsevier's online submission portal. The portal will be open for receiving manuscripts from September 27, 2018, and the submission deadline is October 15, 2018.
http://ees.elsevier.com/tsf/
To ensure that your manuscript is correctly identified for consideration in the Special Issue, it is important that you select 'SI: HWCVD 10' when you reach the "Article Type" step in the online submission process.
All manuscripts should follow the guidelines of regular paper submissions for Thin Solid Films and will undergo the journal's peer-review process. The guest editorial team for this HWCVD10 special issue includes:
Prof. Keisuke Ohdaira (Lead Guest Editor)
Japan Advanced Institute of Science and Technology, Japan
Prof. Ruud E. I. Schropp
Eindhoven University of Technology, The Netherlands
Prof. Yujun Shi
University of Calgary, Canada
Prof. Anna Maria Coclite
Graz University of Technology, Austria
We look forward to your submission!
Abstract Submission
Template
Please fill in the following balnks and submit your abstract. Please use Template .
※Please convert into a PDF when completed.
Presenting author's contact information
Attention
The deadline for the abstract submission is 31. May, 2018 . Abstracts must be restricted to one (1) page with minimum font size of 10 (Times New Roman), 1 line spacing, with 1 1/4″ margins (left, right) and 1″ margins (top, bottom) in A4 paper.
Use Template. Other notes are described in the template.
Download Template .